Equipment
Characterization Equipment
| Equipment Name | Description |
|---|---|
| Hitachi H9500 Environmental Transmission Electron Microscope (ETEM) | The Hitachi H-9500 E-TEM is a microscope specifically designed for in situ observations at environmental conditions up to 10-2 Pa. |
| JEOL Electron Probe Micro Analyzer (EPMA) | This EPMA’s field emission electron gun produces a probe that is only 1/2 to 1/10 the size of that produced in a thermionic emission electron gun in a conventional EPMA, using a tungsten filament or a LaB6 tip. |
| JEOL JEM-2100F Transmission Electron Microscope (TEM) | The Joel JEM2100F is a high resolution TEM which combines routine atomic resolution imaging of crystal lattices via coherent electron scattering or phase contrast (TEM) with incoherent electron scattering (or Z-contrast) in the scanning transmission electron microscopy (STEM) mode. |
| ThermoFisher Scios Focused Ion Beam/Scanning Electron Microscope with EDAX EDS/EBSD | The ThermoFisher Apreo HiVac SEM is a Schottky Field Emission Scanning Electron Microscope (FESEM) that combines high and low-voltage ultra-high resolution capabilities with an electrostatic lens design. |
| ThermoFisher Titan Themis G2 200 Probe Cs Corrected Scanning Transmission Electron Microscope (STEM) | The Thermo Fisher Scientific (formerly FEI) Titan Themis G2 200 Probe Cs Corrected Scanning Transmission Electron Microscope (STEM) is one of the most advanced electron microscopy platforms. |
| Zeiss Gemini 360 with Oxford EDS and EBSD | The Gemini 360 Field Emission Scanning Electron Microscope (FE-SEM) enables high resolution surface examination and analysis. |
| Zeiss Sigma 500 VP FE-SEM with Oxford EDS | The Sigma is a field-emission SEM that produces exceptional images at both high and low accelerating voltages. |
| Equipment Name | Description |
|---|---|
| Bruker Dimension Icon Atomic Force Microscope (AFM) | The Bruker Dimension Icon Atomic Force microscopy [AFM] is a high-performance tip-scanning AFM platform. |
| Bruker X-Ray Diffractometer (XRD) | The Bruker D8 Dsicover SRD instrument is an easy, failsafe system which uses third generation Göbel Mirrors to provide maximal X-Ray flux density, which is essential for all thin film applications. |
| Horiba UVISEL Plus Spectroscopic Ellipsometer | The HORIBA UVISEL Plus Spectroscopic Ellipsometer is a unique instrument that features a photoelastic device which modulates the polarization without any mechanical movement. |
| PANalytical Empyrean X-Ray Diffractometer (XRD) | The Empyrean X-ray diffraction analysis system is intended for use in a wide variety of analytical X-ray diffraction applications. |
| PANalytical Epsilon x-Ray Fluroescence (XRF) | The Epsilon energy-dispersive (XRF) benchtop spectrometer that performs non-destructive analysis of elements from Na (11) to Am (95) in a variety of different sample types, including solids, liquids, pressed and loose powders, slurries and filters. |
| Raman Microscope: HORIBA LabRAM Soleil | The LabRAM Soleil is a state-of-the-art, user-friendly Raman microscope developed by HORIBA Scientific. |
| STA 6000 - Simultaneous Thermal Analyzer (TGA/DSC) | The STA 6000 Simultaneous Thermal Analyzer offers real-time measurement and analysis of sample weight change and heat flow. |
| TA Instruments Discovery DSC250 Differential Scanning Calorimeter (DSC) | The TA Instruments Discovery DSC250 is a Differential Scanning Calorimeter with a 54 position Autosampler and an RCS90 Refrigerated Cooling System. |
| ULVAC PHI X-Ray Photoelectron Spectrometer (XPS) | PHI GENESIS XPS is the next generation of X-ray Photoelectron Spectrometry (XPS) which gives quantitative elemental composition and chemical state information about the sample surface (top 3 – 10 nm). |
Micro and Nano Fabrication (in cleanroom)
| Equipment Name | Description |
|---|---|
| Electron Beam Lithography System: Raith EBPG5150 100kV | The EBPG5150 Electron Beam Lithography (EBL) System is an ultra-high performance e-beam writer for nanodevice fabrication. |
| Heidelberg MLA100 Direct Write Lithographer | The Heidelberg Direct Write Lithography system is a flexible, high resolution photolithography tool for direct writing. The MLA100 automatically detects the perimeter of the sample and uses a digital mask to sequentially expose smaller pattern fields to yield a unified design. |
| Heidelberg MLA150 Direct Write Lithographer | The Maskless Aligner MLA 150 is a state-of-the-art Maskless Lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.) MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. |
| Mask Aligner – Quintel Q4000 MA | The Quintel Q4000 MA Mask Aligner is an efficient and adaptable photolithographic tool. It supports both vacuum and contact printing and effectively exposes both partial and whole substrates up to 100mm (4”) diameter. |
| Nanoscribe 3D Lithography System | The Nanoscribe Photonic Professional is an easy-to-operate table-top laser lithography system that enables the fabrication of true three-dimensional nanostructures using commercially available photoresists. |
| Raynolds Hoods (Acid, Spinner, Developer) | Acid, Spinner, and Developer hoods. |
| YES HMDS Oven | The Trion Phantom III LT RIE (Reactive Ion Etching) is a highly anisotropic and selective etching system which simultaneously uses physical and chemical plasma etching techniques to remove metal films and compound semiconductors. |
| Zeiss Axio Imager Motorized Optical Microscope | The Axio Imager is an optical microscope equipped with next generation optics that have superb contrast and excellent resolution. The microscope design is optimized for maximum stability and vibration-free work. |
| Equipment Name | Description |
|---|---|
| AJA Hybrid Sputter/Evaporation System (located in Physics) | The AJA Hybrid System is a physical vapor deposition tool which deposits films on a substrate using sputtering and e-beam evaporation methods. |
| Angstrom COVAP Thermal Evaporator | Four source thermal evaporator. |
| Angstrom NEXDEP Sputtering System | The Angstrom Engineering sputtering system a physical vapor deposition tool designed for rapid deposition. |
| Anric AT410 Atomic Layer Deposition (ALD) | The ANRIC AT410 is a small form factor, tabletop, thermal ALD system. The AT410 enables deposition of a wide range of materials, including oxides, nitrides and metals utilizing precursors, O3 and O2 gas. |
| Fiji 200 Plasma Enhanced Atomic Layer Deposition (PE-ALD) | The Ultratech Fiji G2 plasma system is a high-vacuum atomic layer deposition system with the capacity to deposit thin films to an atomically specified thickness. |
| Parylene Deposition Coater | The Parylene Deposition Coater PDS 2010 applies conformal Parylene coatings to components such as circuit boards, sensors, wafers, medical devices, MEMS and elastomeric components for research, development, and repairs. |
| Plassys E-Beam Evaporation System | The Plassys Electron Beam Evaporator MEB550S is a state of the art physical vapor deposition tool that uses an intense electron beam to vaporize a source material under high vacuum, offering a wide range of well-controlled deposition rates for a variety of materials. |
| Trion Plasma Enhanced Chemical Vapor Deposition (PECVD) | The Trion Technology Orion III PECVD (Plasma Enhanced Chemical Vapor Deposition) system utilizes plasma to significantly lower the temperatures at which a given film is deposited on a substrate. The Orion III can be used for the controlled deposition of SiNx, SiO2, and SiOxNy films. |
| Equipment Name | Description |
|---|---|
| Plasma Asher (March500) | The March PX-500 Plasma Asher is a highly versatile plasma etch tool that can etch using a direct plasma configuration, a downstream plasma, and a directional plasma (Reactive Ion Etch). |
| PlasmeTherm APEX ICP-RIE Etcher Chlorine | The Plasma-Therm APEX ICP (Inductively Coupled Plasma) RIE Chlorine Etch is an etching system which uses chlorine based chemistries to etch metal films and compound semiconductors. |
| PlasmeTherm APEX ICP-RIE Etcher Fluorine | The Plasma-Therm APEX ICP (Inductively Coupled Plasma) RIE Fluorine Etch is an etching system which uses Fluorine based chemistries to etch Si, SiO2, SiN and other materials. |
| Trion Reactive Ion Etcher (RIE) | The Trion Phantom III LT RIE (Reactive Ion Etching) is an etching system which uses fluoride solutions to etch metal films and compound semiconductors. |
| Equipment Name | Description |
|---|---|
| Filmetrics F40 Thin Film Analyzer | The Filmetrics F40 Thin-Film Analyzer is a tabletop tool capable of quick and reliable measurement of thickness and optical constants (n and k) of transparent thin films. |
| Keyence VHX-X1 Digital Microscope | The Keyence VHX-7020, is a high-performance digital microscope system that supports a wide range of advanced features, is specifically adapted for surface inspection applications, and is suitable for diverse collection of sample types. |
| Keyence VK -X3000 3D Surface Profiler | The Keyence VK-X3000 microscope is a highly advanced 3D surface profiler that offers a range of applications and features designed for precise surface measurement and analysis. |
| Surface Profiler: Bruker DektakXT | The Bruker Dektak-XT is a semi-automated stylus profiler that can be used to measure step height with better than 5 Å repeatability, surface roughness, as well as 3D surface mapping. |
| Zeiss AXIO Optical Microscope | The Axio Imager is an optical microscope equipped with next generation optics that have superb contrast and excellent resolution. The microscope design is optimized for maximum stability and vibration-free work. |
| Zeiss Gemini FE-SEM 360 | The Gemini 360 Field Emission Scanning Electron Microscope (FE-SEM) enables high resolution surface examination and analysis. Microscope has integrated navigation camera enables rapid sample loading. |
| Equipment Name | Description |
|---|---|
| Oxidation/Annealing Tube Furnace | Across International Tube furnace for silicon wafers oxidation and samples annealing. |
| Rapid Thermal Annealer (Solaris 100) | The SSI Solaris100 is a Rapid Thermal Processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. |
| Equipment Name | Description |
|---|---|
| ADT 7122 Wafer Dicer (Room SB02A) | The Advanced Dicing Technology (ADT) 7122 is an automatic wafer dicer with 6" diameter dicing area. It is an advanced, fully programmable saw for dicing thin materials into smaller pieces with 1-micron accuracy. |