The Trion Phantom III LT RIE (Reactive Ion Etching) is a highly anisotropic and selective etching system which simultaneously uses physical and chemical plasma etching techniques to remove metal films and compound semiconductors.
Key Features
- Operation temperature ambient to 160° C
- Handles wafers up to 4”
- Programmable process time and temperature
Key Applications and available processes
- Vapor prime
- Vacuum bake
Check Availability
Already have an account?
Reserve this tool with the FOM.
Equipment Fee
Fabrication Service Tier 1
Core Facility
Gertrude E. and John M. Petersen Institute of NanoScience and Engineering
Location
Lower Campus
Equipment Type
Lithography