The March PX-500 Plasma Asher is a highly versatile plasma etch tool that can etch using a direct plasma configuration, a downstream plasma, and a directional plasma (Reactive Ion Etch). The March Plasma Asher is used for the removal of photoresists from etched wafers, wafer descum, and wafer cleaning prior to wet etching, among other applications. It is capable of high photoresist ashing rates with minimal exposure to electrostatic discharge (ESD).
Key Features
- Stainless Steel chamber taking wafers to 4”
- 13.56 MHz frequency; power output up to 600 W
- Microprocessor-controlled
- Recipe editor for fast, versatile parameter control
- 2 mass flow controllers (O2 and N2)
Key Applications and available processes
- Photo-resist stripping
- Wafer descum/cleaning
- Etching of passivation layers
- Cleaning of filters and membranes
- Chemical trace analysis
- MEMS
- Photonics
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Equipment Fee
Fabrication Service 1
Core Facility
Gertrude E. and John M. Petersen Institute of NanoScience and Engineering
Location
Lower Campus
Equipment Type
Dry Etching