The Angstrom Engineering sputtering system a physical vapor deposition tool designed for rapid deposition. The system is equipped with four magnetron sputtering guns which use accelerated, positively charged ions from a plasma source to deposit films.
Key Features
- 4 Onix 3” Sputter Sources – one sputter source capable of depositing magnetic materials
- Base pressure <2x10-7 Torr (approximately 20 mins to 5×10-6 Torr)
- Substrates up to 4”
- DC, pulsed DC (1000W) and RF (600W) generators
- Switch for Sputter Power Supply - Allows 1 power supply to be shared between 2 sources
- Advanced Downstream Gas Pressure Control – Reactive sputtering (O2, N2, Ar)
- RF Stage Bias - 100W
- Deposition Rate Sensor and PC Based Deposition Rate and Film Thickness Control
- Substrate heating(to 850C) and biasing
Key Applications and available processes
- Metal, oxide, and nitride thin film coatings
- Currently available targets:
- Fe, Al, Ti, W, Ag, Mo, Al2O3, WO3,
- SiO2, Si, Ge2Sb2Te5, GeTe, Sb2Te3
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Equipment Fee
Fabrication Service 2
Core Facility
Gertrude E. and John M. Petersen Institute of NanoScience and Engineering
Location
Lower Campus
Equipment Type
Thin Film Deposition